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The roots of Sensonor and its technology go back to 1965. In 1985 the Company started operating as an independent entity under the name Sensonor, until it was acquired by Infineon Technologies in 2003. In 2009 the company split from Infineon in a MBO supported by local investors to continue its focus on MEMS based sensors, however aiming at applications and markets requiring high precision sensors with a special focus on inertial (Gyro and IMU). From 2012 Sensonor has been under ownership of a Swiss based investment group.

Based out of Horten, about 100 km south of Oslo in Norway, Sensonor has for more than 25 years played a significant role in the development of the global MEMS industry. Over the years, more than 250 million pressure sensors, more than 250 million accelerometers, and more than 2 million gyros have been shipped to customers for use in numerous type of applications. Probably the most important reason for this success is the extremely low failure rate experienced by customers relaying on Sensonor products; less than 1 failure in 10 million parts shipped.
During the early nineties, Sensonor developed its triple stack hermetic wafer bonding technology that has shown extremely good long term properties. In short the technology is based on a combination of micro machined single crystalline silicon and micro machined glass wafers. These wafers are then bonded together using anodic bonding and a controlled gas pressure creating electrical connections into the bonded cavity by utilizing semiconductor diffusions buried under a layer of epitaxial silicon.

These stable long term properties have been explored within High Precision applications by customers using our pressure sensors as well as by customers using our ButterflyGyroTM sensors. Sensonor has on this platform launched a number of High Precision products aiming to:

  • Replace traditional High Precision technology by offering lower cost and better robustness in smaller housings using less power at equal performance
  • Enable new High Precision applications by offering low cost and high robustness in small housings using low power at performance levels not available in today’s market

Being in the forefront of advanced technology requires the most efficient research, development and manufacturing arrangements. Sensonor operates its own 150 mm wafer fab for advanced heterogeneous MEMS processes and several fully equipped assembly and test lines. Additionally to our own staff Sensonor develop solutions in cooperation with partners that are global leaders in their respective areas.

 

 

STIM202

STIM202

STIM202 is a shock capable, tactical grade, affordable, robust and reliable, ultra high performance (Bias Stability 0.5°/h, ARW 0.20°/√h) MEMS gyro module with up to 3 axes. An integrated 32-bit microcontroller enables flexible user configuration.

STIM202 is designed with internal shock absorbers for operation in environments with high shocks. It is capable for direct mounting on a range of firing defense applications like remote weapon stations (RWS).

Use for : Navigation / Stabilization / Industrial / Agriculture / Aerospace / Maritime  / Subsea  / Defense

  • Miniature package
  • ITAR free
  • Excellent performance in vibration and shock
  • Excellent environmental robustness
  • 1, 2 or 3 axes offered in same package
  • Electronically calibrated axis alignment
  • 24 bits resolution
  • Single-crystal silicon technology
  • Low bias drift
  • Low noise

STIM210

STIM210

STIM210 is a small, tactical grade, affordable, robust and reliable, ultra high performance (Bias Stability 0.5°/h, ARW 0.15°/√h) MEMS gyro module with up to 3 axes. An integrated 32-bit microcontroller enables flexible user configuration. Electronic axis alignment is standard.

Use for : Navigation / Stabilization / Industrial / Agriculture / Aerospace / Maritime  / Subsea  / Defense

  • Miniature package
  • ITAR free
  • Excellent performance in vibration and shock
  • Excellent environmental robustness
  • 1, 2 or 3 axes offered in same package
  • Electronically calibrated axis alignment
  • 24 bits resolution
  • Single-crystal silicon technology
  • Low bias drift
  • Low noise

STIM300 – Inertial Measurement Unit

STIM300

STIM300 is a small, tactical grade, low weight, high performance non-GPS aided Inertial Measurement Unit (IMU). It contains 3 highly accurate MEMS gyros, 3 high stability accelerometers and 3 inclinometers. The IMU is factory calibrated and compensated over its temperature operating range.

The STIM300 IMU is well suited for stabilization, guidance and navigation applications in Industrial, Aerospace and Defense markets. It is a crucial building block for inertial navigation systems in UAVs, AUVs, AGVs, UGVs and ROVs.

Weight: <0,12 lbs (<55g)

  • Volume: <2,2 cu. in. (35cm3)
  • ITAR free
  • Insensitive to magnetic fields
  • Solid state – high reliability
  • Low gyro bias instability (0.5°/h)
  • Low gyro noise (0.15°/√h)
  • Low accelerometer bias instability (0.05mg)
  • Customer configurable output format, sampling rate and filter settings

 

David Kriheli | Applications Engineer | david.kriheli@arazim.co.il |Phone: 072-3361104 / Mobile: 050-8092866